Intel and others plan to replace the ubiquitous and speedy USB 2.0 serial technology by releasing the specifications of the next version of USB in the first half of 2008.
Speaking at the Intel Developer Forum (IDF), Pat Gelsinger, general manager of Intel's Digital Enterprise Group, said:
Intel is working fellow USB 3.0 Promoters Group members Microsoft, Hewlett-Packard, Texas Instruments, NEC and NXP Semiconductors to release the USB 3.0 specification in the first half of 2008.
Here is a summary of the key features in USB 3.0:
- Up to 10 times faster, or about 4.8 gigabits per second
- Offers greater energy efficiency
- Has backward compatibility
- Comes with either optical and/or copper connections
Before you get too excited, note that there's typically a one- to two-year lag between the release of specifications and the actual arrival of the technology. However, Intel does have a working prototype at the IDF right now.
You can read more about the report at CNET News Blog.
In the meantime, perhaps you can share with us what you would use USB 3.0 for.
Paul Mah is a writer and blogger who lives in Singapore, where he has worked for a number of years in various capacities within the IT industry. Paul enjoys tinkering with tech gadgets, smartphones, and networking devices.