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I am veeery curiuous regarding the flash memory at image 63. It seems like they have used a pitch adaptor for this. The pitch of this BGA is troublesome and requires an expensive PCB production process(micro via). This is probably a good way for reducing the cost.

Bill, could you please describe how this is done? I see there is used some EMI(?) foam in between the adaptor and the main board PCB.

Thanks!