Well far as the form factor goes, the writer in your his article stated that " The motherboard could also be for the next generation iphone. Umm if you look closely at the images you will see obviously the circuit is too big to even possibly be a mobile phone form factor. By saying this, if you look at the first photo with the motherboard resting on bubble wrap you will see that the bubbles are bigger and four bubbles of each set are the same size of the only three big chips as the CPU and chipset. This is definitely not an iphone motherboard.