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Well far as the form factor goes, the writer in your his article stated that " The motherboard could also be for the next generation iphone. Umm if you look closely at the images you will see obviously the circuit is too big to even possibly be a mobile phone form factor. By saying this, if you look at the first photo with the motherboard resting on bubble wrap you will see that the bubbles are bigger and four bubbles of each set are the same size of the only three big chips as the CPU and chipset. This is definitely not an iphone motherboard.
I agree, theres very little chance of it being an iPhone motherboard. Looking at the previous articles of the ipad2 teardown and the crack open iphone 4s will show its likely to be an ipad motherboard. I think its a good idea to compare dual core and quad core CPUs, because more does not always mean better.
http://www.techrepublic.com/photos/apple-ipad-2-teardown/6201759?tag=thumbnail-view-selector;get-photo-roto
http://www.techrepublic.com/photos/cracking-open-the-apple-iphone-4s/6315300?tag=content;siu-container
http://www.techrepublic.com/photos/apple-ipad-2-teardown/6201759?tag=thumbnail-view-selector;get-photo-roto
http://www.techrepublic.com/photos/cracking-open-the-apple-iphone-4s/6315300?tag=content;siu-container
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