Date Added: Jun 2012
3D integration is a promising advanced manufacturing process offering a variety of new hardware security protection opportunities. This paper presents a way of securing 3D ICs using Hamiltonian paths as hardware integrity verification sensors. As 3D integration consists in the stacking of many metal layers, one can consider surrounding a security-sensitive circuit part by a wire cage. After exploring and comparing different cage construction strategies (and reporting preliminary implementation results on silicon), the authors introduce a "Hardware canary".