Hardware

3D Integration of CMOL Structures for FPGA Applications

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Executive Summary

In this paper, a novel three-dimensional CMOS-nano hybrid technology, 3D CMOL, is introduced to establish FPGA chips. By combining two leading technologies, hybrid CMOS/nanoelectronic circuit (CMOL) and 3D integration, 3D CMOL can provide a feasible and more efficient fabrication/assembly process than the existing 2D CMOL. Furthermore, 3D CMOL FPGA implements circuits in three dimensions so that it can increase the density of the nanodevices and achieve higher performance compared to 2D CMOL and Field Programmable Nanowire Interconnect (FPNI).

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