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Preventing silicon chips from negative, even disastrous thermal hazards has become increasingly challenging these days; Considering thermal effects early in the design cycle is thus required. To achieve this, an accurate yet fast temperature model together with an early-stage, thermally optimized, design flows are needed. In this paper, the authors present an improved block-based compact thermal model (HotSpot 4.0) that automatically achieves good accuracy even under extreme conditions. The model has been extensively validated with detailed finite-element thermal simulation tools.
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