Download now Free registration required
Three main trends that are shaping the embedded device market today are smaller form factors, standardization, and improved performance per watt. In addition, applications across all device categories, from signal processing in aerospace devices to multimedia processing in consumer devices, continue to require higher performance. However, the traditional method of achieving higher performance, increasing the processor clock frequency, causes the thermal dissipation of the processor to increase as well, and higher thermal dissipation drives up the overall platform energy requirements. In contrast, Multi-Core technology benefits devices and applications by improving performance per watt ratios and by reducing the board real-estate required by multiple-processor designs that place only one core in each package.
- Format: PDF
- Size: 328.1 KB