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As the technology enters the nano dimension, the inherent unreliability of nanoelectronics is making fault-tolerant architectures increasingly necessary in building nano systems. Because fault-tolerant hardwares help to mask the effects caused by increased levels of defects, testing the functionality of the chip together with the embedded fault-tolerance becomes a tremendous challenge. In this paper, a new bilateral testing framework for nano circuits is proposed, where multiple stuck-at faults across different modules in a Triple Module Redundancy (TMR) architecture are considered.
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