Date Added: Jul 2010
The push for lead-free or RoHS-compliant products is resulting in significant changes in packaging materials. Manufacturers of electronic equipment require materials that consistently withstand peak reflow temperatures of 240?C to 260?C. Reflow soldering at these extreme temperatures, especially after extended moisture exposure, introduces several challenges that must be solved to produce reliable products. This white paper covers some of the modifications necessary and Altera packaging solutions available to meet reliability and usability requirements for lead-free and RoHS-compliant products.