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The rapid growth in integration technology has been made possible by the automation of various steps involved in the design and fabrication of VLSI chips. The main factors which decide the quality of any chip are power consumption, area and performance of the chip. The demand of light weighted & compact chip is increase day by day. This paper reviewed the different techniques of compaction of any chip and comparison among them because different techniques have different tradeoffs. The appropriate technique is used depending upon requirements.
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