Design Methodologies and Innovative Architectures for Mixed-Signal Embedded Systems
The continuous evolution of VLSI technologies, especially CMOS and its variants (HVMOS, BCD, RF CMOS, etc.), has enabled the integration of complex functionalities in a single, heterogeneous embedded system. Digital subsystems, such as microprocessors,memories, or communication interfaces, can be integrated onto the same substrate (System-on-Chip) or the same package (System-in-Package) together with RF blocks, analog acquisition and processing circuits, analog power drivers, and even micromechanical parts for sensors and actuators. Overcoming the classic dichotomy between analog and digital domains, such new generation of mixed-signal embedded systems is fueling the development of more efficient and performance solutions in several technology areas.