Implementation of Single-Wire Communication Protocol for 3D IC Thermal Management Systems Using a Thin Film Thermoelectric Cooler
The authors propose and implement a single-wire communication protocol for thermal management systems using thin film thermoelectric modules for 3D IC cooling. The proposed single-wire communication protocol connects the temperature sensors, located near hot spots, to measure the local temperature of the chip. A unique ID number identifying the location of each hot spot is assigned to each temperature sensor. The prototype chip was fabricated by a 0.13 m CMOS MPW process, and the operation of the chip is verified.