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Thermal monitoring has been broadly used to protect high-end integrated circuits from over-heating and to identify hot-spots in complex circuits. In this paper, the authors present a method to increase the sensitivity of an on-chip digital thermal sensor. In contrast to the existing mechanisms that characterize the overall temperature profile on a die, the solution is able to detect the submerged thermal variation caused by Specific Predefined Events (SPE), under the precondition that the SPE's major frequency component does not overlap with those of other thermal events. This is made possible by pre-filtering of the temperature value.
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