Processors

Interaction of Scaling Trends in Processor Architecture and Cooling

Free registration required

Executive Summary

It is predicted that two important trends are likely to accompany traditional CMOS semiconductor technology scaling chip multiprocessors and 3D integration. With the ever increasing power consumption and the consequent difficulty in heat removal, it is important to consider the limits and implications of different cooling methods for the upcoming many core and 3D era. In this paper, the authors consider both technology scaling and many core architecture scaling trends in conjunction with conventional air cooling and advanced microchannel cooling for both 2D and 3D microprocessors and identify interesting inflection design points down the road.

  • Format: PDF
  • Size: 455.02 KB