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An opto-electronic hybrid integrated platform was developed to enable the fabrication of broadband, lowcost, and compact transceivers for telecommunications. On this platform, an opto-electronic device such as a high-speed laser or a photodetector chip is integrated with a RF driver or an amplifier IC. A Kovar heatsink with multistep structure is designed for ease of optical coupling using a laser welding process. In order to control the high frequency resonances and improve the signal integrity, AlN based subcircuits are designed to feed the RF and DC signals separately. The interconnection networks between the IC and the optoelectronic device and also between the chips and high-speed transmission lines are carefully investigated to optimize the microwave performances.
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