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Pre-bond testing of 3-D stacked Integrated Circuits (ICs) involves testing each individual die before bonding. The overall yield of 3-D ICs improves with pre-bond testability because manufacturers can avoid stacking defective dies with good ones. However, pre-bond testability presents unique challenges to 3-D clock tree design. First, each die needs a complete 2-D clock tree to enable pre-bond test. Second, the entire 3-D stack needs a complete 3-D clock tree for post-bond test and operation. In the case of a two-die stack, a straightforward solution is to have two complete 2-D clock trees connected with a single Through-Silicon-Via (TSV).
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