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The modeling of power and thermal behavior of modern processors requires challenging validation approaches, which may be complex and in some cases unreliable. In order to address some of the difficulties associated with the validation of power and thermal models, this paper describes an infrared measurement setup that simultaneously captures run-time power consumption and thermal characteristics of a processor. This paper uses infrared cameras with high spatial resolution (10x10?m) and high frame rate (125Hz) to capture thermal maps.
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