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The Intel 45nm processor, originally referred to by the codename Penryn, based on Intel Coret microarchitecture, is the first processor that uses multicore-on-die design to maximize performance and minimize power consumption. This paper provides an overview of how the Penryn processor's mobility platform and package design teams delivered the Penryn silicon in smaller and thinner packages that enabled customers to design both smaller and thinner form-factor platforms. It also provides insight into the mechanical and electrical challenges of these families of thin, small, form-factor packages, challenges that were overcome without incurring significant performance degradation.
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