Date Added: Jan 2011
Three-Dimensional (3D) circuits reduce communication delay in multicore SoCs, and enable efficient integration of cores, memories, sensors, and RF devices. However, vertical integration of layers exacerbates the reliability and thermal problems, and cooling efficiency becomes a limiting factor. Liquid cooling is a solution to overcome the accelerated thermal problems imposed by multi-layer architectures. In this paper, the authors first provide a 3D thermal simulation model including liquid cooling, supporting both fixed and variable fluid injection rates. The model has been integrated in HotSpot to study the impact on multicore SoCs. They design and evaluate several dynamic management policies that complement liquid cooling.