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Communication plays a crucial role in the design and performance of multi-core Systems-on-Chip (SoCs). Networks-on-Chip (NoCs) have been proposed as a promising solution to simplify and optimize SoC design. However, it is expected that improving traditional communication technologies and interconnect organizations will not be sufficient to satisfy the demand for energy-efficient and high-performance interconnect fabrics, which continues to grow with each new process generation. Multiple options have been envisioned as compelling alternatives to the existing planar metal/dielectric communication structures.
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