On-Chip High Speed Optical Interconnect With RLCG Electrical Interconnect: Challenges and Dimensions

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Executive Summary

Intrachip Optical Interconnects (OIs) has the potential to outperform electrical wires and to ultimately solve the communication bottleneck in high-performance integrated circuits. Performance targets and critical directions for Ics progress are yet to be fully explored. In this paper, the International Technology Roadmap for Semiconductors (ITRS) is used as a reference to explore the requirements that silicon-based Ics must satisfy to successfully outperform copper Electrical Interconnects (IEs). Considering the state-of-art devices, these requirements are extended to specific IC components.

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