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Optical Proximity Communication in Packaged SiPhotonics

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Executive Summary

This paper reports 10Gb/s Optical-Proximity-Communication with reflecting mirrors micro-machined into Si and co-integrated to low loss SOI waveguides for chip to chip communication using a self-aligned-packaging mechanism with measured 4.0 dB coupling loss. There continues to be growing interest in scaling high performance computing to meet the ever-increasing computational demands generated by new applications from military and commercial sectors. To date architects are combating these challenges by devising processor chips with multi-core, multithreaded solutions as well as attempting higher speed clocking. But demand from high-end applications continues to grow at an even greater pace. Processors with up to 8 cores and 64 threads are now commercially available and an 80-core experimental processor has been proposed .

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