Robust Optimization of a Chip Multiprocessor's Performance Under Power and Thermal Constraints

Power dissipation and die temperature have become key performance limiters in today's high-performance Chip Multi-Processors (CMPs.) Dynamic power management solutions have been proposed to manage resources in a CMP based on the measured power dissipation, performance, and die temperature of processing cores. In this paper, the authors develop a robust framework for power and thermal management of heterogeneous CMPs subject to variability and uncertainty in system parameters. More precisely, they model and formulate the problem of maximizing the task throughput of a heterogeneous CMP (a.k.a., asymmetric multi-core architecture) subject to a total power budget and a per-core temperature limit.

Provided by: University of Southampton Topic: Hardware Date Added: Aug 2012 Format: PDF

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