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Although CMOS feature size scaling has been the source of dramatic performance gains, it has lead to mounting reliability concerns due to increasing power densities and on-chip temperatures. Given that most wearout mechanisms that plague semiconductor devices are highly dependent on these parameters, significantly higher failure rates are projected for future technology generations. Traditional techniques for dealing with device failures have relied on coarse-grained redundancy to maintain service in the face of failed components. In this paper, the authors challenge this practice by identifying its inability to scale to high failure rate scenarios and investigate the advantages of finer-grained configurations.
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