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The most important characteristic is a battery of mobile communication system with high performance, low power consumption and small size. Small form factor, and realize the System on Chips (SoC) and 3 D die-stacking (3 D-IC) method is to use multiple-chip instead of traditional solutions. Discusses the low voltage memory challenge created the circuit design and new memory solution and 3 D- IC mobile System on Chip (SoC) application. The authors explore new processor-memory architecture interface and the memory of the mobile and 3 D-IC SoC design.
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