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The Y-architecture for on-chip interconnect is based on pervasive use of 0-, 120-, and 240-degree oriented semi-global and global wiring. Its use of three uniform directions exploits on-chip routing resources more efficiently than traditional Manhattan wiring architecture. This paper gives in-depth analysis of deployment issues associated with the Y-architecture. The contributions are as follows: The authors analyze communication capability (throughput of meshes) for different interconnect architectures using a multi-commodity flow approach and a Rentian communication model. Throughput of the Y-architecture is largely improved compared to the Manhattan architecture, and is close to the throughput of the X-architecture. They improve existing estimates for the wirelength reduction of various interconnect architectures by taking into account the effect of routing-geometry-aware placement.
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