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This paper illustrates the performance advantages of 3D integrated circuits with two specific examples, namely 3D-FPGA and 3D-SRAM. Three-dimensional Chip (3D IC, 3D-IC, or 3-D IC) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor industry is pursuing this promising technology in many different forms, but it is not yet widely used. Through strategic modification of the architectures to take advantage of 3D, significant improvement in speed and reduction in power consumption can be achieved.
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