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Tri-Gate Bulk CMOS Technology for Improved SRAM Scalability

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Executive Summary

A simple approach for manufacturing quasi-planar tri-gate bulk MOSFET structures is demonstrated and shown to be effective for reducing variation in 6T-SRAM read and write margins, in an early 28nm CMOS technology. With optimization of the pocket implant doses, quasi-planar bulk CMOS technology can facilitate voltage scaling. It also provides a means to achieve high yield with a notch-less 6T-SRAM cell layout, to facilitate area scaling.

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