WIRE BONDING IN MICROELECTRONICS, 3/E by George Harman 3.0.1 (Mobile)

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WIRE BONDING IN MICROELECTRONICS, 3/E George Harman McGraw-Hill Professional January 20, 2010 The Industry Standard Guide to Wire Bonding--Fully Updated The definitive resource on the critical process of connecting semiconductors with their packages. Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more. COVERAGE INCLUDES: Ultrasonic bonding systems and technologies, including high-frequency systems Bonding wire metallurgy and characteristics, including copper wire Wire bond testing Gold-aluminum intermetallic compounds and other interface reactions Gold and nickel-based bond pad plating materials and problems Cleaning to improve bondability and reliability Mechanical problems in wire bonding High-yield, fine-pitch, specialized-looping, soft-substrate, and extreme-temperature wire bonds Copper, low-dielectric-constant (Cu/Lo-k) technology and problems Wire bonding process modeling and simulation CD includes all of the book's full-color figures plus animations. About Iceberg The Iceberg Reader revolutionizes the reading experience, making it easier than ever to browse, buy and enjoy books. Features - Attractive interface provides a natural reading experience with full pagination. - Table of Contents incorporates one click navigation. - Vertical and horizontal page orientation. - Adjust font size with a pinch, text reflows automatically. - Search the text within a book. - Create margin notes with user notation. About Scrollmotion ScrollMotion, creator of the Iceberg Reader, is a content technology company based in New York City. For more information, visit www.scrollmotion.com. Support If you have any technical problems please email us at icebergsupport@scrollmotion.com before you post a review.
Format:Software Size:21739.00
Version:3.0.1 Date:Jun 2010
Platform:Mobile Price:89.99
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