Cooling Solutions for Rack Equipment With Side-to-Side Airflow
Source: APC by Schneider Electric
Equipment with side-to-side airflow presents special cooling challenges in today's data center. Common rack enclosures and rack layouts are fundamentally incompatible with side-to-side cooling, resulting in excessive temperatures and ultimately reduced equipment reliability. This paper describes these challenges along with several side effects that are generally not appreciated.
| Format: | Size: | 733.70 | |
| Date: | Feb 2005 |
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