Enabling Ethernet-Over-NG-SONET/SDH/PDH Solutions for MSPP Linecards
Traditionally, the development of application-specific chip products such as ASSPs is based on foundry manufacturing, either in-house or via commercial foundries. FPGAs also are based on this manufacturing process, but due to their broader and more generic application, the production volume that FPGAs attain justifies investment in the latest manufacturing processes and technology. In turn, this benefits the designer with lower power consumption and greater integration resulting in a lower cost per logic unit. One company taking advantage of the power, cost, and integration benefits of FPGAs is TPACK. TPACK provides application-specific chip products based on FPGAs.