CES 2017: Verizon and Qualcomm Technologies partner to boost industrial IoT development

Verizon and Qualcomm Technologies recently announced new ThingSpace-ready modules, which use a Qualcomm LTE modem and could make it easier and faster to bring IoT solutions to market.

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At the 2017 Consumer Electronics Show (CES) in Las Vegas on Tuesday, Verizon and Qualcomm Technologies announced a partnership that could help developers bring IoT solutions to market faster and more efficiently, while helping companies better manage connected devices.

According to a press release, Verizon's ThingSpace IoT platform has been integrated with Qualcomm Technologies' MDM9206 Category M1 LTE modem, which makes for easier management of IoT devices, and quickens the pace by which IoT products can be commercialized. To showcase this, Verizon and Qualcomm Technologies introduced new modules from Quectel and Telit that utilize the integration.

"Using the integrated application processor in the MDM9206 LTE modem, OEMs can develop cost-effective and small-footprint devices and incorporate the benefits of LTE connectivity into many new IoT applications," the press release stated.

SEE: CES 2017 Special Coverage (CNET) | CES 2017 (TechRepublic) | CES 2017: The Big Trends for Business (ZDNet)

For example, Telit's vice president of sales for the Americas, Dennis Kelly, said in the press release that the company's ME910C1 module can "be applied as a simple drop-in replacement for existing 2G, 3G and CDMA devices."

The solution can also be customized to meet the needs of specific industries, the release said. IoT use cases in asset management, industrial automation, wearables, and smart cities were mentioned as examples.

"Together with Qualcomm Technologies, Telit and Quectel, we're offering a simple, seamless way to create edge access by incorporating LTE connectivity into these new applications," Mark Bartolomeo, vice president of connected solutions for Verizon, said in the release. "In other words, we're simplifying IoT to increase participation rates across all segments, particularly the mid-size businesses that benefit the most from IoT solutions."

Verizon also announced a development kit which, along with the modules from Quectel and Telit, will be available sometime this year.

At CES, Qualcomm Technologies also announced a new suite of IoT deployment features called the Qualcomm Network IoT Connectivity platform, as well as an expansion of its Qualcomm Wi-Fi Self Organizing Network (SON) solution.

As the IoT ecosystem continues to grow and expand, especially among enterprises and industrial environments, it will be increasingly important to have a solid infrastructure. With these partnerships and expansions, companies like Verizon and Qualcomm Technologies have an opportunity to position themselves as a go-to provider.

The 3 big takeaways for TechRepublic readers

  1. At CES 2017, Qualcomm Technologies and Verizon partnered to integrate Verizon's ThingSpace IoT platform with Qualcomm Technologies' MDM9206 Category M1 LTE modem, which could make it easier and faster to deploy IoT solutions.
  2. The partnership was displayed with modules from Quectel and Telit, which make it easier to add connectivity to devices and to manage them.
  3. Qualcomm Technologies also announces a new Qualcomm Network IoT Connectivity platform, and improvements to its Qualcomm Wi-Fi Self Organizing Network (SON) solution.

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