Enabling Next-Generation Platforms Using Intel's 3D System-in-Package Technology

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Provided by: Intel
Topic: Tech & Work
Format: PDF
This white paper evaluates system requirements for next-generation platforms and explains why conventional solutions may no longer be able to meet these requirements effectively.

The paper introduces the heterogeneous 3D system-in-package (SIP) technology featured in Intel Stratix 10 FPGA's and SoC's.

This technology enables next-generation platforms by offering higher bandwidth, lower power, a smaller form factor and increased functionality and flexibility.

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