Association for Computing Machinery
Memories play a key role in FGPAs in the forms of both programming bits and embedded memory blocks. FPGAs using non-volatile memories have been the focus of attention with zero boot-up delay, real-time reconfigurability, and superior energy efficiency. This paper presents a novel Three-Dimensional (3D) non-volatile FPGA architecture using Phase Change Memory (PCM) and 3D die stacking techniques. Basic structures in a conventional FPGA architecture are renovated with PCM, and components are repartitioned and reorganized in 3D-NonFAR to allow an efficient 3D integration of PCM elements.