A Comparative Study of Mixed CNT Bundle with Copper for VLSI Interconnect at 32nm

Provided by: International Journal of Engineering Trends and Technology
Topic: Hardware
Format: PDF
The aggressive technology scaling in VLSI leads to decrease the size of chip. Such continual miniaturization of VLSI devices has strong impact on the VLSI technology in several ways. The performance of ICs have been increased and the interconnect delay becomes much more significant. Copper interconnects have become a significant performance limiter. Thus, to overcome from the limitation of copper carbon nano-tubes have been proposed as a possible replacement of copper interconnects. Several different configuration of CNT have been proposed out of which mixed CNT configuration have received much attention for their unique characteristics and as a possible alternative to Cu interconnects in future ICs.

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