A Study on Experimental and Numerical Analysis for Improvement of OLED DDI Thermal Performance

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Provided by: AICIT
Topic: Hardware
Format: PDF
The thermal problems of DDI (Display Driver IC) for OLED (Organic Light Emitting Device) have been emerged in recent years. Thus, in this study, the thermal performance of DDI with two-metal layer FPC (Flexible Printed Circuit) has been verified for next generation model. The temperature distribution of the chip and film was first predicted by numerical analysis and verified through a thermal experiment. A carbon block, nichrome wire and a copper block were used for alternatives of DDI in the experiment.
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