Three-Dimensional Network-on-Chips (3D NoCs) are suitable communication fabrics for high-density 3D many-core ICs. Such networks have shorter communication hop count, compared to 2D NoCs, and enjoy fast and power efficient TSV wires in vertical links. Unfortunately, the fabrication process of TSV connections has not matured yet, which results in poor vertical links yield. In this paper, the authors address this challenge and introduce AFRA, a deadlock-free routing algorithm for 3D mesh-based NoCs that tolerates faults on vertical links. AFRA is designed to be simple, high performance, and robust.