Ambient Variation-Tolerant and Inter Components Aware Thermal Management for Mobile System on Chips

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Provided by: edaa
Topic: Hardware
Format: PDF
In this paper, the authors measure and study two key aspects of the thermal behavior of Smartphone: thermal interaction between the components on the printed circuit board and the influence of phone's ambient temperature which is subject to large variations. The measurements on the Smartphone running typical workloads show that the heat generated by the communication subsystem and the high temperatures on the back cover of the phone can increase the System-on-Chip (SoC) temperature by as much as 17 degree Celsius. None of the run-time thermal management studies presented to date considered this interaction, as there was no model available.
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