An Energy Efficient DRAM Subsystem for 3D integrated SoCs

Provided by: European Design and Automation Association
Topic: Hardware
Format: PDF
Energy efficiency is the key driver for the design optimization of System-on-Chips (SoCs) for mobile terminals (Smartphone's and tablets). 3D integration of heterogeneous dies based on TSV (through silicon via) technology enables stacking of multiple memory or logic layers and has the advantage of higher bandwidth at lower energy consumption for the memory interface. In this paper, the authors propose a highly energy efficient DRAM subsystem for next-generation 3D integrated SoCs, which will consist of a SDR/DDR 3D-DRAM controller and an attached 3D-DRAM cube with a fine-grained access and a very flexible interface.

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