Architectural-Level Prediction of Interconnect Wirelength and Fanout

Provided by: Institute of Electrical & Electronic Engineers
Topic: Hardware
Format: PDF
In this paper, the authors propose accurate architectural-level interconnect wirelength and fan-out models. Existing models are based on Rent's rule and fail to capture the impact of microarchitectural and implementation parameters. Hence, significant deviation is observed when validated against implementation data, i.e., up to 79% (22%) in total wirelength (average fanout). Their proposed models both enable architectural-level prediction of interconnect wirelength and fanout, and show significant accuracy improvement vs. existing models with respect to layout data.

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