Carbon Nanotube Prospects as on Chip VLSI Interconnects

Provided by: Creative Commons
Topic: Hardware
Format: PDF
Within the confines of the topic the authors aim to acquaint the need, present trend and viability of the research in CNT as on-chip VLSI interconnects. The need to discuss the topic arises from the fact that the conventional materials used as interconnects like Cu/Al are subjected to many glitches like high electro-migration resistance, surface roughness, grain boundary scattering, interconnect scaling, multiple interconnect stacks, leakage power, support to FinFET, etc. in nano-meter regime. This in turn raises the need to explore new materials which are able to withstand the above limitations and suitable for signal transmission in THz range.

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