Centip3De: A Cluster-Based NTC Architecture With 64 ARM Cortex-M3 Cores in 3D Stacked 130 nm CMOS

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Provided by: Institute of Electrical & Electronic Engineers
Topic: Hardware
Format: PDF
The authors present Centip3De, a large-scale 3D CMP with a cluster-based Near-Threshold Computing (NTC) architecture. Centip3De uses a 3D stacking technology in conjunction with 130 nm CMOS. Measured results for a two-layer, 64-core system are discussed, with the system achieving 3930 DMIPS/W energy efficiency, which is > 3x improvement over traditional operation at full supply voltage. This project demonstrates the feasibility of large-scale 3D design, a synergy between 3D and NTC architectures, a unique cluster-based NTC cache design, and how to maximize performance in a thermally-constrained design.
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