Combining Memory and a Controller with Photonics Through 3D-Stacking to Enable Scalable and Energy-Efficient Systems

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Provided by: Association for Computing Machinery
Topic: Storage
Format: PDF
It is well-known that memory latency, energy, capacity, bandwidth, and scalability will be critical bottlenecks in future large-scale systems. This paper addresses these problems, focusing on the interface between the compute cores and memory, comprising the physical interconnect and the memory access protocol. For the physical interconnect, the authors study the prudent use of emerging silicon-photonic technology to reduce energy consumption and improve capacity scaling. They conclude that photonics are effective primarily to improve socket-edge bandwidth by breaking the pin barrier, and for use on heavily utilized links.
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