Now-a-days, as far as technology going to advances still some problem in VLSI interconnect. Cu interconnect is batter as compared with gold, silver even though cu interconnect also major drawback because billion of transistor were integrating single chip. So, interconnect delay is major problem. In this paper, compares the Cu interconnect with CNT interconnect and performances parameter like power delay and power delay product were taken at Intermediate and global level with different technology for analysis. From the simulation, it found that CNT based interconnect is suited for high performances application.