Cost-Effective Integration of Three-Dimensional (3D) ICs Emphasizing Testing Cost Analysis

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Provided by: Duke University
Topic: Hardware
Format: PDF
Three-Dimensional (3D) ICs promise to overcome barriers in interconnect scaling by leveraging fast, dense inter-die vias, thereby offering benefits of improved performance, higher memory bandwidth, smaller form factors, and heterogeneous integration. However, when deciding to adopt this emerging technology as a mainstream design approach, designers must consider the cost of 3D integration. IC testing is a key factor that affects the final product cost, and it could be a major portion of the total IC cost. In 3D IC design, various testing strategies and different integration methods could affect the final product cost dramatically, and the interaction with other cost factors could result in various trade-offs.
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