Coupling Path Influence on the Conducted Emission Measurement Results by the EMC Semiconductor Test Board
The fact of reduced development time in the automotive sector requires a change in the Electro-Magnetic Compatibility (EMC) validation of electronic components. To increase the development time of automotive components, e.g. sensors or Electronic Control Units (ECUs), it is mandatory to verify the EMC behavior of the Integrated Circuit (IC) itself in an early development stage simultaneous to the development process of the entire ECU into which it is embedded. The conducted IC EMC tests emission as well as immunity is realized with a specific test Printed Circuit Board (PCB) which is built according to the guidelines of the Bosch, Infineon, Siemens VDO Specification (BISS, 2007).