Georgia Institute of Technology
The potential of 3D IC stacking has been examined by researchers for many years. Only recently has the increasing cost of continuing process technology shrinks and the incredible memory-bandwidth demand of multi- and many-core systems brought 3D technology to the forefront of commercial interest. Many universities and companies are actively investigating and investing in 3D stacking technologies for its promise to deliver this extreme bandwidth. In this paper, the authors demonstrate their methodology for designing and analyzing 3D-MAPS (3D MAssively Parallel processor with Stacked memory), a 64-core 3D-stacked memory-on-processor system that demonstrates nearly an order of magnitude higher memory bandwidth at lower operating frequencies compared to previous efforts.