Institute of Electrical & Electronic Engineers
The Three-Dimensional Network-on-Chip (3D NoC) has been proposed to solve the complex on-chip communication issues. However, the thermal problems become more exacerbated because of the larger power density and the heterogeneous thermal conductance in different silicon layer of 3D NoC. To regulate the system temperature, the Dynamic Thermal Management (DTM) techniques will be triggered when the device is thermal-emergent. However, these kinds of reactive DTM schemes result in significant system performance degradation. In this paper, the authors propose a Proactive DTM with Vertical Throttling (PDTM-VT) scheme, which is controlled by the distributed Thermal Management Unit (TMU) of each NoC node.