Provided by: edaa
3D multi-core architectures are seen to provide increased transistor density, reduced power consumption, and improved performance through wire length reduction. However, 3D suffers from increased power density, which exacerbates thermal hotspots. In this paper, the authors present a novel 3D multi-core architecture that reduces processor activity on the die distant to the heat sink and a core-level dynamic thermal management technique based on the architectural adaptation, e.g. dynamically adapting core-resources depending on diverse application requirements and thermal behavior.